Labs
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The Device fab lab at ECE department aims to fabricate devices that should be an affordable, consume low power and portabie. The lab is equipped with the following mesurement instruments:
- Atomic Layer Deposition (ALD)
- Diffusion and Oxidation Machine
- Sputtering Machine (Hind High Vacuum)
- Thermal Evaporation (Hind High Vacuum)
- Keithley Semiconductor Characterization system
- Tunable Light Source (TLS): Newport Corporation
- Lab Scale Electrospinning Machine, Starter Kit from Inovenso Pvt. Ltd, Turkey
- Optical Microscope: Olympus Optical Microscope.
- Mask Aligner SUSS MICROTECH
- Analyte Sensing Setup (Multisensory Measurement System)
The Embedded Systems lab supports teaching and research in embedded systems and re-configurable hardware technology. The lab is engaged in research on architecture, design, and tools for networked and embedded computing and communication systems.Our current interests include wireless sensor and camera trap.
The computational resource facility at ECE department aims to model from sand to protype devices & circuit systems. The followings are the licensed/free softwares available. The students can access both departmental and Institute’s central computing facilities (CCF) to run their computations. More about CCF is detailed
- Circuits & device simulators like TCAD, Synopsis, Cadence, Spice, etc.
- Numerical partial differentiaal equation solver: COMSOL Multiphysics.
- Lisenced density fucntional theory atomistix softwares: QuantumWise, VASP, etc.
- Free preinstalled density fucntional theory atomistix software: Quantum Espresso
The production process of Satellite Communication Lab is led by the assiduous professionals. Our students conceptualize and develop these products while taking into consideration defined parameters of the industry and clients' preference. Keeping in mind divergent demands of the clients, they have made the offered products in different specifications. o study the communication satellite link design: process of transmitting a signal to a satellite (uplinking), reception of same signal via satellite (down linking) and functioning of transponder.
This lab creates integrated circuit technology that enables new applications of wireless sensors. We design chips that enable new levels of system integration, functionality, and robustness. Future wireless smartphone interfaces, body area networks, industrial and home monitoring, and implantable devices demand wireless technology well beyond the state-of-the-art. These applications place increasingly severe demands on circuit and system designers. Miniaturization and power concerns, already important considerations in portable radio design, are amplified in these emerging wireless sensor applications. Additionally, there are several needs on the horizon that will demand completely thin-film integration of RF transceivers, prohibiting surface-mount components of any kind.
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Page last updated date:04-07-2025 06:20 PM
